Topic: Soft-Hard Integrated Soft Systems (SHISS): Design and Applications

The rapid advancement of robotics, artificial intelligence, and human-machine interfaces has driven growing interest in soft-hard integrated systems, particularly flexible and wearable technologies. These systems—ranging from electronic skins to flexible sensors and actuators—enable real-time, adaptive interaction with complex environments. To meet the demands of next-generation applications, integration across materials, hardware, and software is essential.

This Special Issue focuses on the design, fabrication, and application of multifunctional soft systems through cross-disciplinary approaches. We welcome innovative contributions involving flexible biosensors, transistors, photodetectors, solar cells, 3D/4D-printable electronics, wearable/implantable biomedical devices, energy storage devices, and integrated optoelectronic systems. Topics related to wearable electronics, soft system-level integration, and intelligent data processing are also encouraged.

Key areas of interest include but are not limited to:

• System-level material-hardware co-design for multifunctional e-skin platforms.
• Advanced algorithms and AI approaches supporting soft system applications.
• AI4M (Artificial Intelligence for Materials) in soft robotics and sensing.
• Wearable electronics and integrated optoelectronic systems.
• Scalable fabrication of fully integrated flexible systems.
• Flexible biosensors, transistors, photodetectors, energy storage, and solar cells.
• 3D/4D-printable electronics, wearable/implantable devices, biomedical, and bioelectronic.

Electronic skins, human-machine, flexible electronics, wearable electronics, implantable biomedical devices, multifunctional sensors, energy storage, hardware-software system.